Application advantages: Currently, wafer processing can be achieved through four methods: chemical mechanical polishing (low removal rate), dry etching, and wet etching (non-uniform removal, hard-to-control damage layer), all have limitations. The GP0001 polishing wheel works without slurry, rapidly eliminating grinding marks left by diamond wheels and effectively reducing warpage in ultra-thin silicon wafers. It also provides precise control of the back-side damage layer, balancing defect removal with high flexural strength.
Specifications
Outer diameter: 458 mm
Inner diameter: 130 mm
Tooth height: 8 mm
Wheel height: 27 mm
Compatible equipment: DISCO 8761 / 8760
Key Features
1. Slurry-free operation—low cost, high efficiency.
2. Significantly reduces wafer warpage and residual stress.
3. Precisely manages back-side damage layer, delivering excellent defect removal while maintaining high fracture strength.
0371-55983628
sinomach-dia@diamondgroup.cn
