Mainly used in the cutting, grinding, polishing, and transfer processes of silicon, sapphire, gallium arsenide, silicon carbide and other wafer manufacturing processes.
As a high-end carrier tool for chip manufacturing, it has the characteristics of high hardness, small thermal deformation, and uniform breathability. We can provide products up to 12 inches in size with a flatness of ≤ 2um; Surface resistance 106-108 (Ω); Metal ion pollution is extremely low; Reflectance, aperture, and porosity can be customized according to non-standard requirements.
0371-55983628
sinomach-dia@diamondgroup.cn
