Mainly used in fields such as lasers, microwave power devices, and high-power semiconductor lighting, it is an excellent thermal management material for heat dissipation of high heat flux density devices.
Diamond/copper and diamond/aluminum high thermal conductivity composite materials have the characteristics of high thermal conductivity and low expansion coefficient. The room temperature thermal conductivity is more than twice that of copper molybdenum (CMC, CPC) heat dissipation materials.
| Type | Copper/Diamond | Aluminum/Diamond |
| Maximum size |
Φ120mm |
Φ120mm |
| density |
5.4-6.2g/cm3 |
2.8-3.2g/cm3 |
| Maximum thickness |
0.3-5.0 mm |
0.3-5.0 mm |
| Coefficient of thermal expansion |
6-9 ppm/K |
6-11 ppm/K |
| Roughness Ra |
up to 0.2μm |
up to 0.2μm |
| Highest thermal conductivity |
800W/（m·K） |
560W/（m·K） |
0371-55983628
sinomach-dia@diamondgroup.cn
