Mainly used for precision optics, mobile phones, projector lens mold processing, Fresnel lenses, infrared optical crystals (silicon, germanium, tellurium, polycrystalline silicon, zinc sulfide, zinc selenide, KDP crystals, magnesium fluoride), ophthalmic artificial crystals, resin lenses, oxygen free copper, biomedical and industrial sample slicing, jewelry (gold, silver, platinum) industry, watch industry, grinding wheel dressing tools, 3C products, diamond rolling tools, printing and plate making industry, etc.

The waviness of the cutting tool arc can be controlled within 30nm, with a minimum R value of 0.002mm, and the smoothness of the front and rear cutting surfaces can be controlled within 2nm.

Extremely high hardness, strong wear resistance, and long service life; The cutting edge is extremely sharp and can achieve ultra-thin cutting thickness; Under a 1000x microscope, the cutting edge is smooth and defect free, allowing for the production of ultra smooth mirror surfaces.