Mainly used for cutting and wafer grinding protection of various LED and semiconductor packages (QFN/BGA/DFN); Slotting, cutting, and pickling of various coated glass and ordinary optical glass.
The initial adhesive strength of the product is high, with very high adhesiveness, which can firmly fix the components; After being irradiated with ultraviolet light, the adhesive strength of the UV tape rapidly decreases, reaching less than 2.5% of the initial adhesive strength, and the workpiece can be easily removed; Colloidal cohesion is strong, which can ensure that there is no contamination or colloidal residue on the surface when picking up workpieces; We can provide targeted process solutions and customized products.
0371-55983628
sinomach-dia@diamondgroup.cn
