Mainly used for thinning, hard polishing, and CMP polishing processes of LED substrates and semiconductor wafers (sapphire wafers, silicon carbide wafers, silicon wafers, germanium wafers, gallium arsenide wafers, gallium nitride wafers, etc.) as well as other material wafers and window wafers.

The product has the characteristics of high planar accuracy, high morphological accuracy, and high service life. The entire production process is reliable and the quality is stable, achieving excellent service performance of the product under different working conditions. Effectively solves many problems such as electrode pressure damage, disc cracking, and poor corrosion resistance. In practical applications, it has achieved good CMP polishing quality of semiconductor wafer materials.

The maximum size is Φ 1000mm, and the global flatness is ≤ 0.8um; Local flatness ≤ 0.2um; Ceramic surfaces can be used to produce various irregular barcodes, which can be matched with automated production lines.