Mainly used for polishing silicon-based materials, sapphire, special ceramics, optical instruments, Lab grown diamond and other products.
Particle size range M2/0.25-M50/70, uses the short process diamond as raw material. After crushing and shaping processing, can provide different grades, particle size distribution according to different application scenarios, with high purity, excellent grinding performance and wide range of application.
0371-55983628
sinomach-dia@diamondgroup.cn
