Mainly used for edge processing of semiconductor wafers such as silicon, silicon carbide, gallium nitride, gallium arsenide, germanium, sapphire, and ultra-thin liquid crystal glass.
We can provide two types of diamond edge processing grinding wheels: metal bonding agents and resin bonding agents. Through the self created multi system grinding wheel formula library, different design schemes are available for processing different hard and brittle materials such as semiconductor wafers and ultra-thin liquid crystal glass with different dimensional accuracies. Precise matching can be achieved to meet the ultra precision and ultra-high surface quality requirements of edge processing, reaching the leading level in China.
0371-55983628
sinomach-dia@diamondgroup.cn
