Mainly used for grinding semiconductor substrates and wafers such as silicon and compound semiconductors (Silicon carbide, gallium arsenide, indium phosphide, gallium nitride, lithium tantalate, lithium niobate, glass, sapphire), and can also be used for surface grinding of packaging materials, including but not limited to EMC packaging, glass/ceramic packaging, and other composite materials.
Three types of thinning grinding wheels available: ceramic bonding agents, resin bonding agents, and metal bonding agents. The grinding wheel has excellent performance and good grinding surface quality. Suitable grinding wheels and processes can be provided based on the characteristics, dimensions, and equipment used for processing materials, which can meet the diverse development needs of different semiconductor materials and processing grinders.
0371-55983628
sinomach-dia@diamondgroup.cn
