These products replace loose abrasive processing, offering superior finishing performance and a mature, stable manufacturing process.
Applications: Capable of both thinning/lapping and surface polishing, they are widely used for ceramic packages, glass-ceramics, wafer processing, optical prisms, and metal finishing.
Features: Multiple abrasive grit grades provide a broad selection range; long service life and high abrasive utilization reduce costs; excellent self-dressing maintains a stable material-removal rate over time; post-process cleaning ensures high surface quality; performance and process design can be precisely optimized for each application.
0371-55983628
sinomach-dia@diamondgroup.cn
