Mainly used for high-speed, efficient and precise slotting and cutting processing of various packaging devices such as QFN, DFN, BGA, MEMS, LED, PCB board, ceramic substrate, etc. in the semiconductor manufacturing packaging and testing stage.
We can provide various types of packaging knives such as resin bond, metal bond, electroplating bond, etc., covering almost all encapsulation cutting market needs.
The series of packaging knife products have controllable thickness accuracy grading, rich binder formula system and abrasive system, as well as precise and stable process level. The production process is reliable and the quality is stable. According to different cutting materials and cutting quality and efficiency requirements, different binders and abrasives can be matched.
0371-55983628
sinomach-dia@diamondgroup.cn
