Mainly used for rough and precision chamfering of V-shaped grooves on large diameter wafers such as silicon, silicon carbide, sapphire, and glass.
Particle size (800 #~4000 #), groove type (R type, RT type, etc.), etc. can be customized, with good jumping and processing quality, and can achieve micrometer level processing accuracy. The wafer processing quality has reached the leading level in China.
0371-55983628
sinomach-dia@diamondgroup.cn
