Mainly used for grinding semiconductor substrates and epitaxial wafers such as silicon, silicon carbide, gallium nitride, gallium arsenide, indium phosphide, sapphire, as well as precision ceramics, optical glass, metal materials, hard alloys and other materials. It is used for efficient removal of damaged layers such as cutting and thinning, achieving rapid planarization of workpieces.

It can provide three categories of products: water-based system, oil-based system, and oil-water dual-use system. The abrasive particles are in a single particle dispersed and stable fully suspended state, with high processing efficiency, uniform and stable performance, and no scratches caused by particle settling and agglomeration; The proprietary heat absorption and release principle design can effectively solve the heat accumulation during the machining process, avoid problems such as workpiece deformation and geometric parameter loss of control, and achieve ultra precision geometric precision machining; Targeted matching emulsion self-cleaning function can effectively reduce grinding residue and facilitate subsequent cleaning and control; The materials used have non-toxic, harmless and environmentally friendly characteristics.