Laser Dicer
Mainly used for cutting and processing hard and brittle materials such as CVD diamond, HTHP diamond, PCD, natural diamond, and silicon carbide.
Adopting a custom developed diamond cutting laser with higher single pulse energy and excellent beam quality, it has excellent focusing performance, small heat affected area, and can ensure fine and smooth cutting surface without blackening.
After multiple iterations of diamond processing technology, the processing quality, efficiency, and opening loss have reached the industry's first-class level; Customized lasers have an extended lifespan of over 50% compared to commonly used lasers on the market; Adopting an integrated cutting head design and a semi enclosed beam expander, the light path has better dust-proof effect and higher reliability; Customizable development of multiple types and workstations of diamond fixtures; High pixel imaging system for clearer field of view; Intelligent and user-friendly human-computer interaction system, easy to operate quickly.
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