Ceramic Grinding Ring
Mainly used for LED substrate, epitaxial sheet back grinding, polishing process.
Sintered from high-purity aluminum oxide powder, it has the characteristics of high hardness, high precision, good shape retention, no need for dressing, long life, etc. It is especially suitable for the grinding and polishing process of products with high precision requirements such as wafers or chips, and can realize the online high-precision dressing of the grinding disk and the uniform dispersion of the grinding liquid.
According to the standard Q/ ZMS029-2008 to provide ceramic dressing ring, outer diameter range: φ182-576 mm, and can design and manufacture a variety of non-standard products according to user requirements. Main supporting equipment: grinding machine, polishing machine of Chuangji, NTS, Keelers, Tesio and other manufacturers.
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