Chemical Mechanical Polishing (CMP) Solution
Mainly used for the processing of semiconductor material substrates and epitaxial wafers such as silicon, silicon carbide, gallium nitride, gallium arsenide, indium phosphide, sapphire, as well as other materials such as precision ceramics, optical glass, metal materials, hard alloys, quartz crystals, gemstone materials, magnetic materials, etc., with nano - and sub nanometer level ultra smooth surfaces.
According to the different materials of the workpiece, various chemical principle products such as catalytic reactions, oxidation reactions, corrosion reactions, electrochemical reactions, etc. can be targeted and matched. Based on specific control requirements such as scratches, roughness, and efficiency, targeted matching of multi abrasive types such as nanodiamonds, nanoalumina, nanoceria, and nanosilica can be achieved.
The polishing solution is evenly dispersed and stable, with high polishing efficiency; Less crystallization and good surface quality; No residue, easy to clean; Environmentally friendly, non-toxic, and compliant with RoHS standards.
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