Pin Chuck
Mainly used for core key processes such as photolithography, range measurement, bonding, annealing, etc. in the front-end process of chips.
Made by sintering high-purity silicon carbide powder, it has the characteristics of high Young's modulus, dense and uniform structure, low thermal expansion coefficient, and long service life. It is particularly suitable for advanced detection processes that require extremely high flatness and low particle count for adsorbing semiconductor chips, as well as metal ion pollution.
12 inch global flatness ≤ 0.3um, local flatness ≤ 0.1um; The surface can be coated with high-purity coating; Has rich chuck design capabilities and can handle wafers with a warpage of 0.8mm; Can meet the cleanliness requirements of advanced processes.
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