Ultra Thin Cutting Wheel for Hard and Brittle Materials of Optoelectronic Industry
Ultra Thin Cutting Wheel for Hard and Brittle Materials of Optoelectronic Industry
Ultra Thin Cutting Wheel for Hard and Brittle Materials of Optoelectronic Industry
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  • Ultra Thin Cutting Wheel for Hard and Brittle Materials of Optoelectronic Industry
  • Ultra Thin Cutting Wheel for Hard and Brittle Materials of Optoelectronic Industry
  • Ultra Thin Cutting Wheel for Hard and Brittle Materials of Optoelectronic Industry

Ultra Thin Cutting Wheel for Hard and Brittle Materials of Optoelectronic Industry

Mainly used for efficient cutting and grooving of optical glass materials such as ordinary optical glass, coated glass, quartz glass, high borosilicate glass, Faraday rotation glass, ceramic materials such as alumina, aluminum nitride, zirconia, and hard disk magnetic heads.

We can provide various types of ultra-thin cutting grinding wheels such as resin bonding agents, metal bonding agents, electroplating bonding agents, etc. Our formula system is rich and can meet different types of cutting needs; The matching design of binder and abrasive can achieve high-quality and efficient cutting; The precise and stable process level can ensure the batch stability of the blades. It has a series of advantages such as high cutting accuracy, small cutting seam, long cutting life, and good surface quality during processing.